Introduction
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods, especially microscopy and spectroscopy. The NDT or nondestructive testing methods (such as Industrial computed tomography scanning) are valuable because the failed products are unaffected by analysis, so inspection sometimes starts using these methods.
Failure Data Analysis :-Failure data analysis is the process of collecting and analysing data to determine the cause of failure.
It is an important discipline in many branches of manufacturing industry, where it is a vital tool used in the development of new products and for the improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause cause or causes of failure using a wide array methods, especially microscopy and spectroscopy. The failed products are unaffected by analysis so inspection always starts using these methods.
For most equipment items in services, it is natural to observe different time- to -failure when those items are placed in operation simultaneously and under identical conditions . This is because we can expect a certain amount of random behaviour in engineered equipment performance. The variation in performance can become greater when new items and old items are compared . Therefore the value associated with time to failure is not fixed rather it follows a distribution across a range of values.
Method of Analysis
The failure analysis of many different products involves the use of the following tools and techniques
1. Microscopes
2. Sample preparation
3. Spectroscopic analysis
4. Device modification
5. Surface analysis
6. Scanning electron microscopy
7. Laser signal injection microscopy (LSIM)
8. Semiconductor probing
9. Software based fault location technique
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